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Product Data Sheet

Product Catalog Number: Sicrys™  I50DM-106

General Information

Sicrys™ I50DM-106, a conductive ink based on single-crystal silver nanoparticles in diethylene glycol monomethyl ether (DGME), has been designed for inkjet printing and low temperature sintering applications. The ink offers a unique combination of properties, including high silver loading, low viscosity, storage at ambient conditions, long shelf life, reliable jetting and good printability. Printed patterns, sinterable at low temperatures, provide low electrical resistivity and good adhesion to a wide range of substrates.
Ink Properties 
Properties

Metal Loading, Ag (w/w)

Particle Size (Lumisizer®)


Specific Gravity (Calculated)

Viscosity (Brookfield, Cone Spindle 40, 25ºC)

Surface Tension (Pendant Drop Method)

Particle Size and Morphology (HRSEM)
Typical Values

50 %

d50 = 80 nm 
d90 = 115 nm

1.87  g/ml

20 cP
​

34 dyne/cm

See HRSEM image
Picture
Nano  Ag, HRSEM Image, x100,000

Electrical and  Adhesion Properties

Substrates: glass, ITO
Sintering Profile 

150ºC/30min

130ºC/30min

Resistivity (4PP)

≤10 µΩ·cm (≤6.3 bulk)

≤12 µΩ·cm (≤7.5 bulk)

Sheet Resistance

10 mΩ/□ (10 μm)

12 mΩ/□ (10 μm)
Adhesion  (tested): ITO, glass
​(ASTM 3359-09 or ISO-2409)

Picture
Viscosity profile

Compatible printheads 

​Ink works well, among others, with printheads:

KM1024, KM1024i, Ricoh E3, DMC-11610, Sapphire QS-10pl
Product Applications

Digital Printing (Inkjet, aerosol)
Printed Electronics: FPD, RFID, PCB
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  • Home
  • About Us
    • About Us
    • Management Team
    • Board of Directors
    • Advisors
  • Technology
    • Solution
    • Mass Production Applications
    • Digital vs. Screen Printing
    • Sicrys™ Technology
    • R&D Funded Projects >
      • R&D Consortia
      • eurstars™ inkjetPCB
      • Project DigiMan
    • IP & Patents
  • 我们的技术
  • Products
    • Silver Inks >
      • General Purpose
      • Solar, Ceramic & Glass
    • Copper Inks
    • Resistor Inks
    • Gold Ink
    • LIFT Paste
    • Printers
    • Request Quotation
  • 制 品
  • NEWS
    • Press Releases
    • In The News
    • Newsletters
    • Blog
  • Investors
  • Contact Us