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Product Data Sheet

Product Catalog Number: Sicrys™  IC50TM-8
General Information

Sicrys™ IC50TM–8, a conductive ink based on single-crystal copper nanoparticles in triethylene glycol monomethyl ether (TGME), is suitable for various digital printing technologies such as Inkjet and Aerosol systems. The ink offers high copper loading, low viscosity, reliable jetting with high open time, good printability, long shelf life, storage at room temperature (under Argon). Printed and laser sintered patterns provide low electrical resistivity and good adhesion to substrates.
​
* This product is still in R&D stage.
Ink Properties

Properties 

Metal Loading, Cu (w/w)​

Cu(0) in Copper Nano Particles 


Particle Size (Lumisizer®)​
​​

Specific Gravity 

Viscosity (Brookfield, Cone Spindle 40, 25ºC)

Surface Tension (Pendant Drop Method)

Particle Size and Morphology (HRSEM)

​Typical Values

50 %

>95 %


d50 = 50 nm
d90 = 120 nm


1.85 g/ml 

32 cP

34 dyne/cm


See HRSEM image

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Electrical and Adhesion Properties

Sintering Conditions (on glass)

Laser Sintering
​
Thermal 300 °C/30min (under Argon)

Adhesion to: Kapton, FR4, ITO, glass

​(ASTM 3359-09 or ISO-2409)

Compatible printheads

​Ink works well, among others, with printheads:

KM1024/i, Ricoh E3, DMC-11610, Air Brush

Product Applications

​Digital Printing (Inkjet, Aerosol)
Printed Electronics:
FPD, RFID, PCB
Resistivity (4PP)

 ≤5 µΩ·cm (≤3 bulk)

 ≤120 µΩ·cm (≤70 bulk)
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  • Home
  • About Us
    • About Us
    • Management Team
    • Board of Directors
    • Advisors
  • Technology
    • Solution
    • Mass Production Applications
    • Digital vs. Screen Printing
    • Sicrys™ Technology
    • R&D Funded Projects >
      • R&D Consortia
      • eurstars™ inkjetPCB
      • Project DigiMan
    • IP & Patents
  • 我们的技术
  • Products
    • Silver Inks >
      • General Purpose
      • Solar, Ceramic & Glass
    • Copper Inks
    • Resistor Inks
    • Gold Ink
    • LIFT Paste
    • Printers
    • Request Quotation
  • 制 品
  • NEWS
    • Press Releases
    • In The News
    • Newsletters
    • Blog
  • Investors
  • Contact Us